Home
About
Company Profile
Company Vision
Company Structure
Honorary Qualification
Workshop Display
Application
Products
Electroplated Diamond&CBN Grinding Tools
Resin Bond Diamond&CBN Grinding Tools
Vitrified Bond Diamond&CBN Grinding Tools
Metal Bond Diamond&CBN Grinding Tools
Catalogs
News
Notice
Company News
Industry Knowledge
Video
Contact
Contact Us
Message
English
Products Class
popular microdermabrasion diamond tips and wands in Argentina
factory direct supply microdermabrasion diamond peeling diamond tips and handles popular in central america
China factory supply 8 inch CBN grinding wheels for profile grinding fine grinding polishing
Professional manufacturer supply 2024 diamond peel diamond tips for dermabrasion machines in beauty salons
2024 hot sale Professional manufacturer supply diamond peel diamond tips fitted with desk-top dermabrasion machines
JR opens south China’s exclusive diamond & CBN tools...
Recyclable, innovative
Tooling code of conduct
Safty report tested by dynamic tester imported from Germany
Training center
Sustainability reports per month
Metal bond diamond grinding wheel <br> 1. Mostly uses bronze and other metals as the bond<br> 2. Manufactured by high temperature sintering method.<br> 3. It has high bonding strength, good formability, high temperature resistance, good thermal conductivity and wear resistance, long service life, and can withstand large loads. .
Metal grinding wheel
The company's metal sintered diamond drills have the following features:<br> 1. The metal drill bit has good guidance, suitable for directional drilling with downhole motor, and has small radial vibration;<br> 2. The reasonable arrangement of patented PDC composite sheets of different structures at different positions of the drill bit makes the drill bit more aggressive and abrasive resistant;<br> 3. The strong aggressive design enables the drill to obtain a high ROP;<br> 4. The dynamic flow field simulation technology is applied to hydraulic design to optimize the bottom hole flow field, which is beneficial to improve the speed of chip removal and anti-mud bag.
Metal drill
The diamond nesting tool has the features<br> 1. High efficiency and long service life.<br> 2. The utility model belongs to the field of cutting tools for metal materials, and is especially suitable for small deep hole nesting processing of brittle rare metal materials.<br> 3. The deep hole nesting knife consists of a blade, a guide block, a cutter body and a cutter shank. Four blades and guide blocks are arranged on the cutter body according to the circumference.<br> 4. The geometry of the four inserts, their height, the width of the front cutting edge and the relative position of the plane formed by the front of the insert are unique.<br> 5. The cutting force is shared by four blades when the nesting tool is nesting, the cutting is very stable, the chip separation effect is good, and the cutting efficiency is high.<br> 6. It can be used to complete deep hole nesting with a minimum diameter of 20mm and a depth of 50-100 times the hole diameter.<br>
Diamond Core Drill Bits
product features:<br> 1. High grinding efficiency, good quality and durability;<br> 2. Small grinding force and low grinding temperature;<br> 3. The grinding workpiece has high precision, good surface quality, and good shape retention of the workpiece;<br> 4. It has high wear resistance (the grinding wheel has high wear resistance and low consumption of abrasive particles, especially when grinding very hard and brittle workpieces);
PCD PCBN grinding wheel
Features<br> The company's ceramic silicon wafer thinning grinding wheels have many advantages, so they have been exported to many countries and regions at home and abroad, and have won good reputation and reputation from many cooperative merchants.<br> 1. High grinding efficiency and good polishing performance.<br> 2. Small grinding force, low grinding temperature, long life and durability.<br> 3. The grinding workpiece has high precision, good surface quality and good shape retention of the workpiece.<br> 4. The workpiece material adopts semiconductor materials such as single crystal silicon.<br> 5. The silicon wafer thinning wheel has high wear resistance and low consumption of abrasive particles, especially when grinding very hard and brittle workpieces.<br>
Wafer thinning wheel