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Wafer Thinning Wheel

Features The company's ceramic silicon wafer thinning grinding wheels have many advantages, so they have been exported to many countries and regions at home and abroad, and have won good reputation and reputation from many cooperative merchants. 1. High grinding efficiency and good polishing performance. 2. Small grinding force, low grinding temperature, long life and durability. 3. The grinding workpiece has high precision, good surface quality and good shape retention of the workpiece. 4. The workpiece material adopts semiconductor materials such as single crystal silicon. 5. The silicon wafer thinning wheel has high wear resistance and low consumption of abrasive particles, especially when grinding very hard and brittle workpieces.

Classification:

Products

Vitrified Bond Diamond&CBN Grinding Tools


Product description

Ceramic silicon wafer thinning wheels are mainly used in the thinning and finishing of semiconductor wafers. The company has advanced equipment and strong technical force. The silicon wafer thinning grinding wheel can reach the imported level, which is popular in domestic and foreign markets and has a high cost performance.

Features
Our company's ceramic silicon wafer thinning grinding wheels have many advantages, so they have been exported to many countries and regions at home and abroad, and have won good reputation and reputation from many cooperative merchants.
1. High grinding efficiency and good polishing performance.
2. Small grinding force, low grinding temperature, long life and durability.
3. The grinding workpiece has high precision, good surface quality and good shape retention of the workpiece.
4. The workpiece material adopts semiconductor materials such as single crystal silicon.
5. The silicon wafer thinning wheel has high wear resistance and low consumption of abrasive particles, especially when grinding very hard and brittle workpieces.

 

Product usage
Ceramic silicon wafer thinning wheels are widely used in thinning and polishing of semiconductor wafers, discrete devices, integrated circuit substrate silicon wafers and raw silicon wafers.

 

Product Specifications

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